Papers

With Tag: Electromigration

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Time domain current waveform simulation of CMOS circuits

K H Loh, Anchang Deng, Yanchyuan Shiau
1988 | 10.1109/ICCAD.1988.122495

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An MILP-based aging-aware routing algorithm for NoCs

Kshitij Bhardwaj, Sanghamitra Roy, Koushik Chakraborty
2012 | 10.1109/DATE.2012.6176489

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Theoretical analysis of current-driven interactions between voids in metallic thin films

Jaeseol Cho, M Rauf Gungor, Dimitrios Maroudas
Journal of Applied Physics | 2007 | 10.1063/1.2426901

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Noise measurements in thin‐film interconnections: A nondestructive technique to characterize electromigration

Bruno Neri, P E Bagnoli, A Diligenti, S Ciucci
Journal of Applied Physics | 1988 | 10.1063/1.339925

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Implications of a threshold failure time and void nucleation on electromigration of copper interconnects

Kaushik Chanda, Ronald G Filippi, P C Wang, Andrew Brendler, J R Lloyd
Journal of Applied Physics | 2010 | 10.1063/1.3357161

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Towards optimal CMOS lifetime via unified reliability modeling and multi-objective optimization

Theocharis Theocharides, Agathoklis Papadopoulos, Maria K Michael
2011 | 10.1109/ISCAS.2011.5937749

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Electromigration behaviour of DNA molecules at the free electrolyte–polymer solution interface

Petr Bocek, Zdena Mala, Karel Kleparnik
Journal of Chromatography A | 1997 | 10.1016/S0021-9673(97)00115-5

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On the effect of grain boundary segregation on electromigration driving force in thin metal films

Materials Letters | 1996 | 10.1016/0167-577X(95)00209-X

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On the electromigration failure under pulsed conditions

R E Hummel, Hoang H Hoang
Journal of Applied Physics | 1989 | 10.1063/1.342879

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Electromigration of carbon in alpha-iron

Kenichi Hirano, Hideo Nakajima
Journal of Applied Physics

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Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps

C Y Liu, Y C Chuang, Lin Ke, S J Wang
Journal of Applied Physics | 2006 | 10.1063/1.2357860

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Numerical investigations of the electromigration boundary value problem

J R Lloyd, J J Clement
Journal of Applied Physics | 1992 | 10.1063/1.351204

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Diffusion coefficient and electromigration velocity of copper in thin silver films

R A Rutledge, G Digiacomo, P P Peressini
Journal of Applied Physics | 1974 | 10.1063/1.1663466

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